An apparatus (100) is provided for dispersing heat from an integrated circuit (202) to a heat sink (404). The apparatus (100) is formed on a nonconductive body (102) having at least two conductive surfaces (110, 112) disposed thereon. One of the conductive surfaces (110) is reflowed to a heat generating lead of the integrated circuit (202), and the other conductive surface (112) provides a surface for contacting a heat sink (404). The apparatus (100) and integrated circuit provide a package (200) which can be tape and reeled (300) for easy mounting to a printed circuit board (402) of a communication device (400).