Semiconductor sensor chips are assembled with semiconductor communication chips to form sensor nodes which are wired together and placed in a tube preform which is sealed to form a tube containing an array of sensor nodes. The tube, resembling a wire in appearance, can then be assembled with power conductors to form a power delivery cable to allow monitoring of conditions within the cable at a plurality of spaced locations along the length of the cable so that the cable can be operated near or at its actual current carrying capacity which may be altered by ambient conditions and allowing management of risk of failure of the cable.