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Multi-layer chip overlay target and measurement

Invented by: Christopher P. Ausschnitt
Boca Raton, FL

Nelson M. Felix
Hopewell Junction, NY

Allen H. Gabor
Hopewell Junction, NY Applicant: Name City State Country Type International Business Machines Corporation Armonk NY US

Originally Assigned to: International Business Machines Corporation
Armonk, NY
[Now assigned to . . .]

Issued:2014-09-30
Filed:2012-11-26
Application No:13684787
Examined by:Chaudhuri; Olik

A wafer includes an active region and a kerf region surrounding at least a portion of the active region. The wafer also includes a target region having a rectangular shape with a width and length greater than the width, the target region including one or more target patterns, at least one of the target patterns being formed by two sub-patterns disposed at opposing corners of target rectangle disposable within the target region.

[pdf] U.S. Pat. No. 8,847,416

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